Troubleshooting Copper Non-Cyanide

Troubleshooting Non-Cyanide Copper Plating Solutions

1. Slow or Poor Adhesion

1.1 Poor Surface Preparation

• Check and improve the surface preparation of the workpieces.

1.2 Excess Copper in the Solution

• Dilute the solution or reduce the amount of additive.

1.3 Low pH

• Adjust the pH using Copper C.

2. Burnt Plating at High Current

2.1 Insufficient Copper B

• Increase the amount of Copper B.

2.2 Low Temperature

• Heat the solution to 55°C.

2.3 Excessive Current

• Reduce the current.

2.4 Poor Agitation

• Increase agitation or air flow.

2.5 Heavy Metal Contamination

• Perform a dummy run using high current.

2.6 Low Copper Content

• Add more copper or copper sulfate.

2.7 Excessive Impurities

• Add 10% hydrogen peroxide as tested with Hull Cell.

2.8 pH Above 10.5

• Reduce the pH.

3. Solution Turns Green

3.1 Insufficient Copper B

• Increase the amount of Copper B.

3.2 Poor Agitation

• Increase agitation or air flow.

3.3 Low Temperature

• Heat the solution to 55°C.

4. Incomplete or Darkened Plating

4.1 Oil or Heavy Metal Contamination

• Add 3-5 ml/L hydrogen peroxide, agitate for a long time, heat to 70°C, or filter with 5-10 g/L carbon powder.

4.2 Insufficient Copper B

• Increase the amount of Copper B.

4.3 Excess Copper in the Solution

• Dilute the solution or reduce the amount of additive.

Mixing Instructions

• Preparation: Clean the plating tank and fill it with 50% distilled water.

• Dissolve Copper Sulfate: Stir until the solution is clear.

• Add Copper 220 B: Stir continuously until fully mixed.

• Add Copper 220 A: Add gradually and stir continuously until fully mixed.

• Adjust pH: Use Copper 220 Activator to adjust pH to:

  • For Steel: pH 9–10

  • For Zinc and Aluminum: pH 8.5–9.5

• Add Distilled Water: Fill the tank and stir continuously for 30 minutes.

• Adjust Temperature: Set to the desired operating temperature.

Before plating, activate the surface with 2–5% Copper 220 Activator.

Solution Movement

• Hanging Tanks: Use agitation or air bubbling.

• Barrel Tanks: Use a barrel speed of 3 – 5 RPM.

Filtration

• Continuous Filtration: Filter the solution continuously or at least 3–5 times per hour.

• Filter Size: Use 5–10 micron filters.

Anode and Cathode Setup

• Anodes: Use Oxygen Free High Conductivity (OFHC) copper plates with acid-resistant cloth bags.

• Anode to Cathode Ratio: 2:1–3:1.

• Solution Temperature: 50 – 60°C.

Copper Metal Levels

• New Solution: 6 g/L.

• Working Solution: 6 – 8 g/L.

Current and Plating Speed

• Maximum Current: 2 A/dm².

• Plating Speed: At 1 A/dm², plating rate is 0.17 microns/minute.

Solution Adjustment and Maintenance

• Copper 220A: Use for new solution preparation.

• For Copper Deficiency: Add Copper Sulfate 4 g/L and Copper 220B 16 cc/L.

• Copper Sulfate Adjustment: 1 kg requires 4 L of Copper 220B.

• For Gloss: Adjust Copper 220B as needed, with consumption of 0.8 - 1.0 L per 1,000 ampere-hours (AH).

• pH: Regularly measure and adjust pH with Copper 220 Activator.

Post-Plating Cleaning and Maintenance

• Rinse: Clean thoroughly with water at least 3 times.

• Acid Dip: Dip in 5% sulfuric acid or 5% acid powder to neutralize alkalinity and prevent tarnishing.